SUBASSEMBLY OF FIBER ELECTRONIC

A subassembly (10) for use in packaging an optoelectronic device (e.g., LED or photodiode 11) includes a semiconductor (e.g., silicon) base (22) and lid (24) having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which...

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Bibliographic Details
Main Authors JOHNSON, BERTRAND H, BLONDER, GREG E
Format Patent
LanguageEnglish
Korean
Published 09.05.1992
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Abstract A subassembly (10) for use in packaging an optoelectronic device (e.g., LED or photodiode 11) includes a semiconductor (e.g., silicon) base (22) and lid (24) having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber (20).
AbstractList A subassembly (10) for use in packaging an optoelectronic device (e.g., LED or photodiode 11) includes a semiconductor (e.g., silicon) base (22) and lid (24) having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber (20).
Author JOHNSON, BERTRAND H
BLONDER, GREG E
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
Title SUBASSEMBLY OF FIBER ELECTRONIC
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