PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMATION USING THE SAME

A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2 min -hydroxy-5 min -meth...

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Bibliographic Details
Main Authors KOIBUZI SIKERU, HITACHI LTD, HASIMOTO MIZIAKI, ISOBE ASAO
Format Patent
LanguageEnglish
Korean
Published 06.08.1991
Edition5
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
AUXILIARY PROCESSES IN PHOTOGRAPHY
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2 min -hydroxy-5 min -methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.
Bibliography:Application Number: KR19890003679