THE MANUFACTURING METHOD OF ADHESIVE PREVENTING REAGENT OF EPOXY RESIN

In the case of coating the condenser surface, the adhesive resistant reagent prevents the excess epoxy resin from adhering to the wire. The adhesive resistant reagent consists of a 100-90 wt.% polymerizable compound and a 0-10 wt.% copolymerizable compound. The polymerizable compound containined the...

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Bibliographic Details
Main Authors SHINJO, MASAYOSHI, FUKUI, SHOSHIN
Format Patent
LanguageEnglish
Korean
Published 07.12.1985
Edition4
Subjects
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:In the case of coating the condenser surface, the adhesive resistant reagent prevents the excess epoxy resin from adhering to the wire. The adhesive resistant reagent consists of a 100-90 wt.% polymerizable compound and a 0-10 wt.% copolymerizable compound. The polymerizable compound containined the perfluoro alkyl group with a carbon number or 4-21. The copolymerizable compound was acrylic acid, vinyl ester of aliphatic acid, styrene, vinyl alkyl ketone, diene, etc. This reagent improves on adhesive resistivity and ease of removal.
Bibliography:Application Number: KR19800000840