할로겐화제로서 공반응물을 이용하는 금속의 원자층 에칭

• Main Authors: WOODRUFF JACOB, XIE WENYI, SAARE HOLGER, MOINPOUR MANSOUR, DEZELAH CHARLES, KANJOLIA RAVINDRA, PARSONS GREGORY, MCBRIARTY MARTIN
• Format: Patent
• Language: Korean
• Published: 24.10.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; SEMICONDUCTOR DEVICES

개시되고 청구되는 주제는 염화티오닐(SOCl2) 또는 염화티오닐과 피리딘의 조합을 이용하는 금속과 금속의 합금(예를 들어, 코발트와 코발트 합금)의 열 원자층 에칭(ALE) 프로세싱에 관한 것이다. The disclosed and claimed subject matter relates to thermal atomic layer etch (ALE) processing of metals and alloys thereof (e.g., cobalt and cobalt alloys) using thionyl chloride (SOCl2) or a combination of thionyl chloride and pyridine.