LASER PROCESSING WORK TABLE AND OPERATION METHOD OF THE SAME

• Main Authors: LIM JAE HA, HAN GYOO WAN, LEE SUNG YONG
• Format: Patent
• Language: English; Korean
• Published: 28.08.2024
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CLEANING; CLEANING IN GENERAL; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; HAND TOOLS; MACHINE TOOLS; MANIPULATORS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PORTABLE POWER-DRIVEN TOOLS; PREVENTION OF FOULING IN GENERAL; SOLDERING OR UNSOLDERING; TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

레이저 가공용 워크 테이블은 복수의 셀 영역 및 셀 영역을 구분하는 그루브 영역을 포함하고, 셀 영역에 기판을 고정하는 흡착홀이 형성되며, 그루브 영역에 기판 커팅 시 발생하는 이물을 흡입하는 흡입홀이 형성되는 상부 플레이트 및 상부 플레이트의 하부에 배치되고, 상부 플레이트와 결합하여 흡착홀과 연결되는 흡착 통로 및 흡입홀과 연결되는 흡입 통로를 형성하는 하부 플레이트를 포함한다. A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.