박리성 부여제, 접착제 조성물, 적층체, 및 반도체 기판의 제조 방법

본 발명은, 아미드 결합과 폴리오르가노실록산 구조를 갖는 폴리머를 함유하는, 접착제 조성물이다. An adhesive composition including a polymer having an amide bond and a polyorganosiloxane structure.

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Bibliographic Details
Main Authors SHINJO TETSUYA, FUKUDA TAKUYA
Format Patent
LanguageKorean
Published 30.07.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:본 발명은, 아미드 결합과 폴리오르가노실록산 구조를 갖는 폴리머를 함유하는, 접착제 조성물이다. An adhesive composition including a polymer having an amide bond and a polyorganosiloxane structure.
Bibliography:Application Number: KR20247020394