MOLD RELEASE FILM FOR USE IN MOLD FORMATION AND MOLD FORMATION METHOD

• Main Authors: SUGIYAMA RYUICHI, NAKAGAKI TAKAMITSU, TSUJIUCHI NAOKI
• Format: Patent
• Language: English; Korean
• Published: 29.07.2024
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

몰드 성형에 사용되는 이형 필름으로서, 기재 필름 상에 조성물(I) 또는 조성물(II)로 이루어지는 이형층이 형성되어 있는 것을 특징으로 하는 몰드 성형용 이형 필름, 및 그것을 사용하는 몰드 성형법. 조성물(I); 탄소수 8개 이상의 알킬기를 포함하는 화합물(a) 및 가교제(b)를 함유하는 조성물. 조성물(II); 탄소수 8개 이상의 알킬기와 에틸렌성 불포화기를 포함하는 화합물(α)을 함유하는 조성물. 몰드 성형에 있어서의 밀봉재 경화 후의 박리성이 양호한 몰드 성형용 이형 필름을 저렴하게 제공할 수 있다. Provided are: a mold release film that is for use in mold formation, and that is characterized by being provided with a mold release layer comprising composition (I) or composition (II) disposed on a base material film; and a mold formation method using same. Composition (I) comprises: a compound (a) containing an alkyl group having eight or more carbon atoms; and a crosslinking agent (b). Composition (II) comprises a compound (α) that contains an alkyl group having eight or more carbon atoms and an ethylenically unsaturated group. By this configuration, it is possible to provide an inexpensive mold release film that is for use in mold formation and that exhibits favorable release properties after the hardening of a sealing material in the process of mold formation.