Substrate treating apparatus and semiconductor manufacturing equipment including the same

• Main Authors: KIM JU WON, CHOI BYOUNG DOO, PARK JONG HYUK, JUNG GI HUN, PARK DONG WOON, KIM SEONG SUE, CHO A RAH
• Format: Patent
• Language: English; Korean
• Published: 09.07.2024
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACHINE TOOLS; MATERIALS THEREFOR; METAL-WORKING NOT OTHERWISE PROVIDED FOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

레이저를 이용하여 반도체 기판을 처리하는 기판 처리 장치 및 이를 포함하는 반도체 제조 설비를 제공한다. 상기 기판 처리 장치는, 기판이 처리되는 공간을 제공하는 챔버; 챔버 내에 배치되며, 기판을 지지하는 지지 모듈; 및 챔버 내에 배치되며, 기판 상으로 레이저 신호를 송출하여 기판을 열처리하는 레이저 신호 생성 모듈을 포함하며, 레이저 신호 생성 모듈은 포토레지스트 레이어를 포함하는 기판을 열처리한다. Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.