수지 조성물, 프리프레그, 적층판, 금속 접착 적층판, 프린트 배선판 및 반도체 패키지

• Main Authors: SHIMAOKA SHINJI, SAKAMOTO NORIHIKO, SUTOU KYOUSUKE, KITAJIMA TAKAYO
• Format: Patent
• Language: Korean
• Published: 25.06.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

저열 팽창성을 갖고, 또한, 금속박과의 높은 접착 강도와 높은 땜납 내열성도 발현하는 수지 조성물을 제공한다. 또한, 당해 수지 조성물을 사용하여 제조되는 프리프레그, 적층판, 금속 접착 적층판, 프린트 배선판 및 반도체 패키지를 제공한다. 상기 수지 조성물은, 구체적으로는, (A) 아크릴 폴리머 및 (B) 열경화성 수지를 함유하는 수지 조성물로서, 또한, (C) (C1) 인산에스테르 화합물, (C2) 포스파젠 화합물 및 (C3) 포스파페난트렌 화합물로 이루어지는 군에서 선택되는 적어도 1종을 포함하는, 수지 조성물이다. Provided is a resin composition that has low thermal expansion properties and exhibits high strength of adhesion with a metal foil and high solder heat resistance. Also provided are a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition. Specifically, the resin composition contains (A) an acrylic polymer and (B) a thermosetting resin, said resin composition further including (C) at least one compound selected from the group consisting of (C1) phosphate ester compounds, (C2) phosphazene compounds, and (C3) phosphaphenanthrene compounds.