COATING COMPOSITIONS

• Main Authors: POLLUM JR. MARVIN M, KRILEY JOSEPH P, POWELL ADAM B, PAGNOTTI LOUBNA, MAKSIMOVIC LJILJANA, REARICK BRIAN K, FORTMAN DAVID J, NAKAJIMA MASAYUKI
• Format: Patent
• Language: English; Korean
• Published: 21.06.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

본원에는 조성물이 개시되는데, 상기 조성물은 에폭시-함유 성분, 상기 조성물의 총 중량을 기준으로 11 중량% 초과 내지 25 중량%의 양의 엘라스토머 입자; 및 외부 에너지원에 의해 활성화될 수 있는 경화 성분으로서, 상기 경화 성분은 동적 광 산란에 의해 측정된 D90 입자 크기가 25 ㎛인 하나 이상의 구아니딘을 포함하는 경화 성분을 포함한다. 또한 적어도 부분적으로 경화된 상태의 조성물이 개시된다. 또한, 기재를 처리하는 방법이 개시되는데, 상기 방법은 상기 조성물을 기재의 표면에 도포하는 단계; 및 외부 에너지원을 적용하여 상기 조성물을 경화시키는 단계를 포함한다. 또한, 상기 조성물을 포함하는 기재가 개시된다. 또한, 본 발명의 방법에 의해 형성된 기재가 개시된다. Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 µm measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.