Semiconductor chip splitting method using a laser and semiconductor chip splitted by THE same

• Main Authors: JUNG JIHUN, KWON SOYEON, LEE CHUNGSUN, KO YEONGKWON
• Format: Patent
• Language: English; Korean
• Published: 20.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

반도체 기판의 전면 위에 배선을 형성하는 베올 공정 단계, 상기 반도체 기판의 후면에 하부 트렌치를 형성하는 단계, 상기 하부 트렌치와 중첩하는 영역을 따라 상기 반도체 기판에 레이저 스크라이빙 라인을 형성하는 단계, 상기 반도체 기판을 상기 스크라이빙 라인을 따라 절개하여 칩 단위로 분할하는 단계를 포함하는 레이저를 이용한 반도체 칩 분할 방법을 제공한다. A semiconductor chip splitting method using a laser includes: performing a back-end-of-line (BEOL) process comprising forming wiring at or above a front surface of a semiconductor substrate; forming a lower trench at a rear surface of the semiconductor substrate; forming a laser scribing line on the semiconductor substrate along a region overlapping the lower trench; and splitting the semiconductor substrate into chips by a process comprising cutting along the laser scribing line.