가요성 및 신장성 구조체들

• Main Authors: RIVERA TREVOR ANTONIO, NELSON KATHERINE M, HOPKINS MICHAEL ADVENTURE, KINZEL CHARLES J, RONAY MARK WILLIAM
• Format: Patent
• Language: Korean
• Published: 17.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

디바이스들, 시스템들 및 방법들은 기판 층, 기판 층에 결합된 금속 층, 기판 층 및 금속 층에 결합된 캡슐화제, 및 스텐실-인-플레이스 구조체를 포함한다. 캡슐화제는 금속 층을 환경 조건들로부터 전기적으로 고립시키도록 구성된다. 스텐실-인-플레이스 구조체는 스텐실 기판, 및 스텐실 기판에 의해 형성된 비아 및 채널 내에 고정된 전도성 겔을 포함하고, 전도성 겔은 금속 층에 전기적으로 결합된다. A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.