RELEASE FILM FOR SEMICONDUCTOR MOLDING AND METHOD OF PRODUCING SEMICONDUCTOR PACKAGE

• Main Authors: YANAGITA YUKI, TAKAHASHI YOSHIMASA
• Format: Patent
• Language: English; Korean
• Published: 02.05.2024
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

[과제] 이형성을 유지하면서, 대전 방지 성능이 우수한 반도체 성형용 이형 필름, 및 이를 이용하는 반도체 패키지의 제조 방법을 제공한다. [해결 수단] 이형층과 도전층과 기재층을 이 순서대로 가지며, 상기 이형층이 도전성 폴리머를 포함하는, 반도체 성형용 이형 필름.