cleaning agent composition for substrate for semiconductor devices and method for cleaning substrate for semiconductor devices using the same

• Main Authors: HEO YU JIN, LEE HAG SUNG, YIM NARAE, LEE MYUNGHO, YOU JINHO, KANG YOUNG MEE, KIM HYE JI, KIM KEON YOUNG, CHOI YUN SUN
• Format: Patent
• Language: English; Korean
• Published: 02.05.2024
• Subjects: ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES; BASIC ELECTRIC ELEMENTS; CANDLES; CHEMISTRY; DETERGENT COMPOSITIONS; DETERGENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FATTY ACIDS THEREFROM; METALLURGY; RECOVERY OF GLYCEROL; RESIN SOAPS; SEMICONDUCTOR DEVICES; SOAP OR SOAP-MAKING; USE OF SINGLE SUBSTANCES AS DETERGENTS

본 발명은 반도체 기판 세정제 조성물 및 이를 이용한 반도체 기판 세정방법에 관한 것으로서, 화학식 1로 표시되는 실리콘계 화합물 및 유전상수가 10 이하인 비양성자성 유기용매를 포함함으로써, 고 종횡비를 가지는 미세패턴의 수세 세정공정에도 패턴의 무너짐을 방지할 수 있는 표면 보호막을 형성할 수 있고, 이에 따라 반도체 제조 수율을 개선한 반도체 소자 제조방법을 제공할 수 있다. The present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device and a method for cleaning a substrate for a semiconductor device using the same. The cleaning agent composition contains a silicon-based compound represented by Formula 1 and an aprotic organic solvent with a dielectric constant of 10 or less, which can form a surface protective film capable of preventing collapse of the pattern even in a wet cleaning process of fine patterns with high aspect ratios, thereby providing a method for manufacturing a semiconductor device with an improved semiconductor manufacturing yield.