기판 처리 장치 및 방법

• Main Authors: BLOMBERG TOM, KIVIOJA JANI, KUITUNEN ANTTI, ALAKOSKI HEIKKI, POUTIAINEN JUHO
• Format: Patent
• Language: Korean
• Published: 24.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR RELEVANT APPARATUS; TRANSPORTING

적어도 하나의 기판을 처리하기 위한 반응 챔버(20), 및 서로에 대해 이동 가능한 상부(70) 및 하부(80) 부분을 포함하는 변형 가능한 인피드 어셈블리(85)로서, 반응 챔버(20)를 향해 반응물 흐름을 용이하게 하는 수직으로 연장된 상태 및 기판 로딩을 허용하는 수직으로 움츠린 상태 사이에서 변형하도록 구성되는 변형 가능한 인피드 어셈블리(85); 및 변형 가능한 인피드 어셈블리(85)의 상부 부분(70)에 커플링된 탄력성 관형 도관(150)을 포함하는 기판 처리 장치(100). A substrate processing apparatus (100), comprising a reaction chamber (20) for processing at least one substrate, and a deformable in-feed assembly (85) comprising an upper (70)and a lower (80) portion movable with respect to each other, the deformable in-feed assembly (85) being configured to deform between a vertically extended state facilitating a reactant flow towards the reaction chamber (20), and a vertically retracted state allowing substrate loading, and a resilient tubular conduit (150) coupled to the upper portion (70) of the deformable in-feed assembly (85).