감광성 수지 조성물, 전자 디바이스의 제조 방법 및 전자 디바이스

폴리아마이드 수지 및/또는 폴리이미드 수지를 포함하는 감광성 수지 조성물로서, 감광성 수지 조성물을 170℃에서 2시간 가열하여 얻어진 경화막을, 이하 조건에서 동적 점탄성 측정을 했을 때의 220℃에서의 저장 탄성률 E'220이 0.5~3.0GPa인, 감광성 수지 조성물. [조건] 주파수: 1Hz 온도: 30~300℃ 승온 속도: 5℃/분 측정 모드: 인장 모드 A photosensitive resin composition comprising a photosensitive resin composition containin...

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Main Authors KAWANAMI TAKUJI, TANAKA YUMA, KAWASAKI RITSUYA
Format Patent
LanguageKorean
Published 02.04.2024
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Abstract 폴리아마이드 수지 및/또는 폴리이미드 수지를 포함하는 감광성 수지 조성물로서, 감광성 수지 조성물을 170℃에서 2시간 가열하여 얻어진 경화막을, 이하 조건에서 동적 점탄성 측정을 했을 때의 220℃에서의 저장 탄성률 E'220이 0.5~3.0GPa인, 감광성 수지 조성물. [조건] 주파수: 1Hz 온도: 30~300℃ 승온 속도: 5℃/분 측정 모드: 인장 모드 A photosensitive resin composition comprising a photosensitive resin composition containing a polyamide resin and/or a polyimide resin, wherein when a cured film obtained by heating the photosensitive resin composition at 170°C for 2 hours is subjected to a dynamic viscoelasticity measurement using the following conditions, the storage modulus E'220 of the cured film at 220°C is 0.5-3.0 GPa. [Conditions] Frequency: 1 Hz Temperature: 30-300°C Temperature elevation rate: 5 °C/minute Measurement mode: Tensile mode
AbstractList 폴리아마이드 수지 및/또는 폴리이미드 수지를 포함하는 감광성 수지 조성물로서, 감광성 수지 조성물을 170℃에서 2시간 가열하여 얻어진 경화막을, 이하 조건에서 동적 점탄성 측정을 했을 때의 220℃에서의 저장 탄성률 E'220이 0.5~3.0GPa인, 감광성 수지 조성물. [조건] 주파수: 1Hz 온도: 30~300℃ 승온 속도: 5℃/분 측정 모드: 인장 모드 A photosensitive resin composition comprising a photosensitive resin composition containing a polyamide resin and/or a polyimide resin, wherein when a cured film obtained by heating the photosensitive resin composition at 170°C for 2 hours is subjected to a dynamic viscoelasticity measurement using the following conditions, the storage modulus E'220 of the cured film at 220°C is 0.5-3.0 GPa. [Conditions] Frequency: 1 Hz Temperature: 30-300°C Temperature elevation rate: 5 °C/minute Measurement mode: Tensile mode
Author KAWASAKI RITSUYA
KAWANAMI TAKUJI
TANAKA YUMA
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Snippet 폴리아마이드 수지 및/또는 폴리이미드 수지를 포함하는 감광성 수지 조성물로서, 감광성 수지 조성물을 170℃에서 2시간 가열하여 얻어진 경화막을, 이하 조건에서 동적 점탄성 측정을 했을 때의 220℃에서의 저장 탄성률 E'220이 0.5~3.0GPa인, 감광성 수지 조성물. [조건]...
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SubjectTerms APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Title 감광성 수지 조성물, 전자 디바이스의 제조 방법 및 전자 디바이스
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