적층체의 제조 방법, 및 접착제 조성물의 키트

• Main Authors: USUI YUKI, SHINJO TETSUYA, OKUNO TAKAHISA
• Format: Patent
• Language: Korean
• Published: 27.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

본 발명은 지지 기판의 표면에 제 1 접착제 도포층이 형성되는 공정과, 반도체 기판의 표면에 제 2 접착제 도포층이 형성되는 공정과, 제 1 접착제 도포층과 제 2 접착제 도포층과의 첩합 및 가열이 행하여지고, 제 1 접착제 도포층 및 제 2 접착제 도포층으로부터 접착층이 형성되는 공정을 포함하며, 제 1 접착제 도포층이, 제 1 접착제 조성물로 형성되고, 제 2 접착제 도포층이, 제 2 접착제 조성물로 형성되며, 제 1 접착제 조성물 및 제 2 접착제 조성물 중 한쪽이, 제 1 열경화 성분과, 촉매 존재하에서 제 1 열경화 성분과 반응하는 제 2 열경화 성분을 함유하고, 다른쪽이, 촉매를 함유하며, 제 1 접착제 조성물 및 제 2 접착제 조성물 중 적어도 어느 것이, 박리제 성분을 함유하는, 적층체의 제조 방법. A method of manufacturing a laminate, the method including:a step of forming a first adhesive coating layer on a surface of a support substrate;a step of forming a second adhesive coating layer on a surface of a semiconductor substrate; anda step of bonding the first adhesive coating layer and the second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, whereinthe first adhesive coating layer is formed from a first adhesive composition,the second adhesive coating layer is formed from a second adhesive composition, andone of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component.