접착제 조성물, 접착 시트, 적층체 및 프린트 배선판

• Main Authors: SAKAMOTO KOICHI, KAWAKUSU TETSUO
• Format: Patent
• Language: Korean
• Published: 26.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

접착성과 땜납 내열성이 우수하고, 나아가서는 장시간 고온 환경 하에 노출된 후에도 우수한 접착성을 발현하고, 반경화 도막에서의 유연성, 태크성도 만족하는 접착제 조성물, 그리고 그것을 포함하는 접착 시트, 적층체 및 프린트 배선판을 위한 폴리에스테르 수지 (A1), 폴리에스테르 수지 (A2) 및 에폭시 수지 (B)를 함유하는 접착제 조성물. 폴리에스테르 수지 (A1): 수평균 분자량이 10000 미만, 유리 전이 온도가 15℃ 미만이며 또한 1 분자 당 수산기와 카르복시기의 합계로 3 작용기를 갖는 성분 (a)를 구성 단위로서 갖고, 폴리에스테르 수지 (A1)을 구성하는 전체 다가 카르복실산 성분을 100 몰%로 했을 때, 상기 성분 (a)를 3 몰% 이상 갖는 폴리에스테르 수지. 폴리에스테르 수지 (A2): 수평균 분자량이 10000 이상, 유리 전이 온도가 15℃ 이상인 폴리에스테르 수지. Provided is an adhesive composition which exhibits excellent adhesive properties and soldering heat resistance, exhibits excellent adhesive properties even after being exposed to a high temperature environment for a long time, and exhibits satisfactory flexibility and tackiness when in the form of a semi-cured coating film. The adhesive composition contains a polyester resin (A1), a polyester resin (A2) and an epoxy resin (B) and is used for obtaining an adhesive sheet, a layered product and a printed wiring board that contain the adhesive composition. Polyester resin (A1) is a polyester resin which has a number average molecular weight of less than 10,000 and a glass transition temperature of lower than 15ºC and which contains a component (a) having a total of 3 hydroxyl groups and carboxyl groups as functional groups per molecule as a constituent component, with the content of component (a) being 3 mol% or more if the content of all polycarboxylic acid components that constitute the polyester resin (A1) is taken to be 100 mol%. Polyester resin (A2) is a polyester resin having a number average molecular weight of 10,000 or more and a glass transition temperature of 15ºC or higher.