동장 적층판 및 전자 회로 기판

• Main Authors: NOBORI YUMIKO, SONE HISASHI, NOGUCHI MASAKI
• Format: Patent
• Language: Korean
• Published: 18.03.2024
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING

[과제] 폴리이미드 필름의 표면 조도를 저감하고, 또한, 제조 공정에 있어서의 휨을 억제한 동장 적층판의 제공. [해결 수단] 본 발명에 의한 폴리이미드 필름과 동박을 구비하는 동장 적층판은, 상기 폴리이미드 필름이, 폴리이미드 수지와 액정 폴리머 입자를 포함하고, 상기 액정 폴리머 입자가, 하기에서 정의되는 장경, 단경, 및 두께가 하기 (A) 및 (B)의 조건: (A) 장경과 단경의 비인 장단도의 평균치가 1.2 이상인 것, (B) 단경과 두께의 비인 편평도의 평균치가 1.2 이상인 것, 을 만족시키는 것을 특징으로 한다. [Problem] To provide a copper-clad laminate plate in which the surface roughness of a polyimide film is reduced and in which warping during the manufacturing process is suppressed. [Solution] A copper-clad laminate plate according to the present invention comprises a polyimide film and a copper foil and is characterized in that the polyimide film contains a polyimide resin and liquid crystal polymer particles, and the long diameter, the short diameter, and the thickness of the liquid crystal polymer particles as defined below satisfy conditions (A) and (B): (A) the average value of elongation, which is the ratio of the long diameter and the short diameter, is not less than 1.2; and (B) the average value of flatness, which is the ratio of the short diameter and the thickness, is not less than 1.2.