접합용 금속 페이스트, 및 접합체 및 그 제조 방법

• Main Authors: NATORI MICHIKO, NAKAKO HIDEO, EJIRI YOSHINORI, ISHIKAWA DAI, TANAKA TOSHIAKI
• Format: Patent
• Language: Korean
• Published: 12.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CHEMISTRY; CONDUCTORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING METALLIC POWDER

접합용 금속 페이스트는, 금속 입자와, 분산매와, 환원제와, 환원 조제를 포함하고, 금속 입자가, 구리 입자를 함유하며, 환원 조제가, 전자 역공여성을 갖는 배위성 화합물을 포함하고, 당해 배위성 화합물이 유기 인 화합물 및 유기 황 화합물로 이루어지는 군으로부터 선택되는 적어도 1종이며, 환원제로서, 폴리올계 화합물을, 구리 입자의 전체 질량 100질량부에 대하여, 1.6질량부 이상 10질량부 이하 함유한다. A metal paste for bonding includes metal particles, a dispersion medium, a reducing agent, and a reduction aid, in which the metal particles contain copper particles, the reduction aid includes a coordinating compound having electron back-donation properties, the coordinating compound is at least one selected from the group consisting of an organic phosphorus compound and an organic sulfur compound, and the metal paste for bonding contains, as a reducing agent, 1.6 parts by mass or more and 10 parts by mass or less of a polyol-based compound with respect to 100 parts by mass of the total mass of the copper particles.