접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판

• Main Authors: IRISAWA HAYATO, KAWAKUSU TETSUO, SONODA RYO
• Format: Patent
• Language: Korean
• Published: 08.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

[과제] 종래의 폴리이미드, 액정 폴리머뿐만 아니라, 금속 기재와 높은 접착성을 갖고, 높은 땜납 내열성을 얻을 수 있으며, 또한 저유전 특성, 레이저 가공성도 우수한 접착제 조성물을 제공한다. [해결 수단] 변성 폴리올레핀 수지(a), 폴리이미드 수지(b) 및 경화제(c)를 포함하고, 상기 폴리이미드 수지(b)가 폴리올레핀 폴리올, 다이머 디올, 다이머 디아민 및 다이머산으로 이루어지는 군에서 선택되는 적어도 1종류를 구성 단위로서 갖는 접착제 조성물. [Problem] To provide an adhesive composition which has high adhesiveness to not only conventional polyimides and liquid-crystal polymers but also metal substrates, can attain high soldering heat resistance, and is excellent in terms of low-dielectric characteristics and laser processability. [Solution] An adhesive composition comprising a modified polyolefin resin (a), a polyimide resin (b), and a hardener (c), wherein the polyimide resin (b) includes, as a constituent unit, at least one compound selected from the group consisting of polyolefin polyols, dimer diols, dimer diamines, and dimer acids.