Electromagnetic interference shielding and heat dissipation polyimide film with liquid metal and manufacturing method thereof

• Main Authors: CHUNG CHAN MOON, KIM HYUN WOO, JIN YU JI, YOON KANG HOON, KO JU HEE, JIN SEUNG WON, CHOI YUN JE
• Format: Patent
• Language: English; Korean
• Published: 08.03.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

본 발명은 액체금속 충진 전자파 차폐 및 방열 폴리이미드 필름 및 이의 제조방법에 관한 것으로, 폴리이미드를 사용하여 내열성, 내산화성을 가지고 액체금속을 사용함에 따라 고분자 매트릭스 내 전자기적 네트워크 구조를 형성하여 차폐성 및 방열 특성이 우수하고, 공중합체 형태의 고분자를 사용함에 따라 유연성을 가지는 액체금속 충진 폴리이미드 필름 및 이의 제조방법에 관한 것이다.