회로 접속용 접착제 필름, 회로 접속 구조체 및 그 제조 방법

• Main Authors: KUDO SUNAO, IWAMOTO SHINNOSUKE
• Format: Patent
• Language: Korean
• Published: 05.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

회로 접속용 접착제 필름은, 열가소성 수지, 라디칼 중합성 화합물, 및 라디칼 중합 개시제를 함유하는 수지 성분과, 도전 입자를 포함하고, 기수지 성분이, 플루오렌 골격을 갖는 실레인 커플링제를 더 함유한다. This adhesive film for connecting a circuit comprises: a resin component containing a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator; and conductive particles, wherein the resin component further contains a silane coupling agent having a fluorene skeleton.