전기 부품의 절연을 위한 난연성 폴리아미드 성형 배합물

• Main Authors: RESING MARIO, RUBAN ECKART, MERKULOV ALEXEY, FRANOSCH JURGEN, SZENTIVANYI ANDREAS, PHAM DUY VU
• Format: Patent
• Language: Korean
• Published: 04.03.2024
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS

본 발명의 범주는 낮은 인 함량을 갖는 난연성 폴리아미드 성형 배합물에 관한 것이다. A flame-retardant polyamide molding compound may have low phosphorus content. Such a polyamide molding compound may include (A) a polyamide matrix including polyamide(s) having at least 8 carbon atoms per amide unit; (B) a flame retardant composition comprising (B1) metal-free aryl phosphate(s), (B2) aryl phosphonate(s), (B3) carbohydrate polyol(s), (B4) melamine cyanurate(s), and (B5) optionally, non-phosphorus-comprising flame retardant(s). A total phosphorus content from the flame retardant composition may be in a range of from 0.5 to 1.5 wt. %, based on total polyamide molding compound weight