임시 고정제로 사용할 수 있는 조성물

• Main Authors: LOWER YVONNE, HUBER LUKAS, DICKEL TANJA
• Format: Patent
• Language: Korean
• Published: 19.02.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

조성물로서, (A) 20 내지 30 중량%의 하나 이상의 열가소성 중합체, (B) 45 내지 69 중량%의 유기 용매, (C) 2 내지 15 중량%의 실리카 입자, (D) 0.5 내지 10 중량%의 유기 증점제, (E) 1 내지 10 중량%의, 모스 경도 1 내지 8 범위의 입자형 무기 충전제, 및 (F) 0 내지 1 중량%의, (A) 내지 (E)의 구성성분 이외의 하나 이상의 성분으로 구성되는, 조성물. A composition consisting of: (A) 20% to 30% by weight of one or more thermoplastic polymers, (B) 45% to 69% by weight of organic solvent, (C) 2% to 15% by weight of silica particles, (D) 0.5% to 10% by weight of organic thickener, (C) 1% to 10% by weight of particulate inorganic filler having a Mohs hardness in the range from 1 to 8, and (F) 0% to 1% by weight of one or more constituents other than constituents (A) to (E).