휴대용 전자 장치 구성요소를 위한 복합 필름

• Main Authors: WILLIAMS LEWIS KARL, GUNTHER VAL GLADE, APOSTOLO MARCO, CHEN NAN
• Format: Patent
• Language: Korean
• Published: 14.02.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MINERAL OR SLAG WOOL; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

본 발명은 0.10 mm 미만의 두께를 나타내는, 적어도 하나의 플루오로중합체 및 섬유 패브릭으로 제조되는 복합 필름뿐만 아니라, 그러한 복합 필름을 포함하는 물품에 관한 것으로, 상기 복합 필름은 낮은 유전 상수 및 소산 계수를 나타내고, 휴대용 전자 장치 구성요소, 예를 들어 연성 인쇄 회로 기판(FPC)에 적합하다. The present disclosure relates to a composite film made of at least one fluoropolymer and a fiber fabric, presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).