ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM PATTERN-FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD

• Main Authors: TSUBAKI HIDEAKI, NISHIDA YOICHI, KAMIMURA SOU, TOMIGA TAKAMITSU
• Format: Patent
• Language: English; Korean
• Published: 08.02.2024
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

본 발명은 노광 래티튜드 성능이 우수한 감활성광선성 또는 감방사선성 수지 조성물 등을 제공한다. (A) 산의 작용에 의해 알칼리 가용성이 증대하는 수지, (C) 활성광선 또는 방사선의 조사에 의해 산을 발생하는 화합물, 및 (S) 비점이 130 내지 150°C인 용제 SA와, 비점이 155°C 내지 250°C인 용제 SB를 포함하는 용제를 포함하고, 상기 용제 SA의 함유량은 용제 SB보다도 많고, 용제 SB의 전체 용제에 대한 함유량이 1 내지 30질량%이며, 고형분 농도가 10질량% 이상인 감활성광선성 또는 감방사선성 수지 조성물을 제공한다. An actinic ray-sensitive or radiation-sensitive resin composition including a resin (A) undergoing an increase in alkali solubility due to action of acid; a compound (C) generating acid upon irradiation with an actinic ray or radiation; and a solvent (S) including a solvent SA having a boiling point of 130° C. to 150° C. and a solvent SB having a boiling point of 155° C. to 250° C., in which a content of the solvent SA is higher than a content of the solvent SB, the content of the solvent SB relative to the whole solvent is 1% to 30% by mass, and a concentration of solid contents is 10% by mass or more.