ADHESIVE FILM FOR MULTILAYER PRINTED WIRING BOARDS

• Main Authors: SUZUKAWA TAKAYUKI, TEZUKA YUUKI, KATO MAKOTO, MIZUNO YASUYUKI, IRINO TETSUROU, ITOU AKIKO, YOKOSHIMA HIROYUKI, TOMIOKA KENICHI, MATSUURA MASAHARU, KASAHARA AYA, SUGAWARA IKUO
• Format: Patent
• Language: English; Korean
• Published: 06.02.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

(A) 중량 평균 분자량(Mw)과 수 평균 분자량(Mn)의 분산비(Mw/Mn)가 1.05 내지 1.8인 노볼락형 페놀 수지와, (B) 일반식 (1)로 표시되는 에폭시 수지와, (C) 무기 충전재를 포함하는 수지 조성물을, 지지체 필름 위에 층 형성하여 이루어지는 수지 조성물층을 가지며, 그 수지 조성물층 중의 (C) 무기 충전재의 평균 입경이 0.1㎛ 이상이고, (C) 무기 충전재의 함유량이 수지 고형분 중 20 내지 95질량％인, 다층 프린트 배선판용의 접착 필름이다. An adhesive film for multilayer printed wiring boards, which comprises a resin composition layer that is obtained by forming a layer from a resin composition on a supporting film, said resin composition containing (A) a novolac phenolic resin having a dispersion ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of 1.05-1.8, (B) an epoxy resin represented by general formula (1), and (C) an inorganic filler. The average particle diameter of the inorganic filler (C) in the resin composition layer is 0.1 μm or more; and the content of the inorganic filler (C) is 20-95% by mass of the resin solid contents.