프리프레그, 적층판, 금속 피복 적층판, 프린트 배선판, 반도체 패키지 그리고 프리프레그의 제조 방법 및 금속 피복 적층판의 제조 방법

• Main Authors: AOYAMA KAZUKI, SHIMAOKA SHINJI, SAITOH TAKESHI, TONOUCHI SHUNSUKE, TOSAKA YUJI, NAKANISHI KOTA, KITAJIMA TAKAYO, MAGOTA SEIYA, SASAKI RYOHTA
• Format: Patent
• Language: Korean
• Published: 05.02.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MAKING GRANULES OR PREFORMS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; PRINTED CIRCUITS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

두께 40㎛ 이상의 섬유 기재에 열경화성 수지 조성물을 함침해서 이루어지는 프리프레그로서, 상기 섬유 기재 중에 상기 열경화성 수지 조성물의 함침 영역과 미함침 영역을 갖고 있고, 표면 굴곡(Wa)이 5.0㎛ 이하인 프리프레그를 제공한다. 또한, 당해 프리프레그를 사용해서 얻어지는, 적층판, 금속 피복 적층판, 프린트 배선판 및 반도체 패키지를 제공하고, 나아가 당해 프리프레그의 제조 방법 및 당해 금속 피복 적층판의 제조 방법을 제공한다. Provided is a prepreg including a fiber substrate having a thickness of 40 µm or more impregnated with a thermosetting resin composition, the prepreg having in the fiber substrate an impregnated region and a non-impregnated region with the thermosetting resin composition, having a surface waviness (Wa) of 5.0 µm or less. Also provided are a laminate, a metal-clad laminate, a printed wiring board, and a semiconductor package, which are obtained by using the prepreg, a method of producing the prepreg, and a method of producing the metal-clad laminate.