경화성 조성물 및 이의 용도

• Main Authors: YE LVYUAN, XUN WEIWEI, WU QILI, ZHAO BIN
• Format: Patent
• Language: Korean
• Published: 26.01.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

본 발명은 (A) 하나 이상의 (메트)아크릴레이트; (B) 하나 이상의 디아릴요오도늄 염; 및 (C) 하나 이상의 잠재성 아민 촉매를 포함하고, 100 ℃ 미만의 온도에서 열 경화될 수 있으며, 또한 열 경화성 및 방사선 경화성일 수 있는 경화성 조성물을 제공한다. 본 발명의 경화성 조성물은 경화 시에 다양한 기판에 대해 양호한 접착 강도를 나타낸다. The present invention provides a curable composition comprising (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100° C. and can be also thermally curable and radiation curable. The present curable composition exhibits favorable adhesion strength on various substrates when cured.