HEATING JACKET FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

• Main Authors: LEE JOONG HOON, RO YOUNG JU, HWANGBO DAE WOO, KANG KYUNG NAM, KIM BO GEUN, KWAK CHANG HOON
• Format: Patent
• Language: English; Korean
• Published: 17.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; JOINTS OR FITTINGS FOR PIPES; LIGHTING; MEANS FOR THERMAL INSULATION IN GENERAL; MECHANICAL ENGINEERING; PIPES; SEMICONDUCTOR DEVICES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; THERMAL INSULATION IN GENERAL; WEAPONS

본 발명의 기술적 사상에 따른 반도체 제조 설비용 히팅 자켓은, 반도체 제조 설비의 배관을 감싸는 히팅 자켓으로서, 배관의 외주면을 감싸면서 절연 기능을 갖는 내피, 내피의 외측에 배열되는 열선, 열선의 외측을 감싸는 진공 단열재, 및 진공 단열재의 외측면을 감싸면서 절연 기능을 갖는 외피를 포함하고, 히팅 자켓은 배관의 길이 방향으로 복수로 연결되고, 복수의 히팅 자켓 중 일부에는 온도 감지 센서가 배치되고, 복수의 히팅 자켓 중 다른 일부에는 온도 감지 센서가 배치되지 않는다. A heating jacket wrapping a pipe of semiconductor manufacturing equipment includes an internal shell wrapping an outer circumference of the pipe and having an insulation function, a heating line arranged on the outside of an internal shell, a vacuum insulation panel (VIP) wrapping the outside of the heating line, and an external shell wrapping an external surface of the VIP and having an insulation function. A plurality of heating jackets are connected to one another in a longitudinal direction of the pipe. Temperature sensors are arranged in some of the plurality of heating jackets. Temperature sensors are not arranged in the others of the plurality of heating jackets.