METAL-CLAD LAMINATE PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: UCHIMURA RYOICHI, SHIMIZU HIROSHI, SAITOH TAKESHI, NAKAMURA YUKIO, TOSAKA YUJI, SASAKI RYOHTA
• Format: Patent
• Language: English; Korean
• Published: 29.12.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

휨이 효과적으로 억제된 금속장 적층판, 프린트 배선판 및 반도체 패키지를 제공한다. 상기 금속장 적층판은, 구체적으로는, 수지 조성물이 섬유 기재에 부착되어 이루어지는, 하기 식 (1)을 만족하는 프리프레그이며, 또한 하기 식 (2)를 만족하는 프리프레그를 사용하여 이루어지는 금속장 적층판이다. 0.12<{(a1+a2)/2}/B (1) 0.8≤a1/a2≤1.25 (2) (상기 식 중, a1은 섬유 기재의 한쪽 면 상에 존재하는 수지 조성물의 경화 후의 평균 두께이고, a2는 섬유 기재의 다른 쪽 면 상에 존재하는 수지 조성물의 경화 후의 평균 두께이다. B는 섬유 기재의 평균 두께이다.) Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically, the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a following formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12 < a 1 + a 2 / 2 / B 0.8 ‰¤ a 1 / a 2 ‰¤ 1.25