전자부품 제조용 오목판 지그

• Main Authors: SAKAMOTO HITOSHI, SATO EIJI
• Format: Patent
• Language: Korean
• Published: 22.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

전자부품 본체(20, 210)에 도체 페이스트(P)를 도포하여 외부전극(30~38, 240, 250)을 가지는 전자부품(10, 200)을 제조하는 오목판 지그(100, 300)는 탄성체(110, 310)와, 탄성체에 형성되고 도체 페이스트가 수용되는 오목부(120, 320)를 가진다. 오목부는 외부전극의 폭(W1, W5)에 적합한 개구 폭(W2, W6)을 가지는 개구(121, 321)와, 개구로부터 소정 깊이(D)의 바닥면(122, 322)과, 바닥면으로부터 국소적으로 돌출되는 돌출 높이(H1, H2)가 소정 깊이(D)보다 낮은 적어도 하나의 돌출부(130~132, 330)를 가진다. An intaglio jig (100, 300) for manufacturing an electronic component (10, 200) having an external electrode (30 to 38, 240, 250) by applying a conductive paste (P) to an electronic component body (20, 210) includes an elastic body (110, 310), and a recessed portion (120, 320) that is formed in the elastic body and in which the conductive paste is contained. The recessed portion includes an opening (121, 321) having an opening width (W2, W6) that conforms to a width (W1, W5) of the external electrode, a bottom surface (122, 322) at a predetermined depth (D) from the opening, and at least one protrusion portion (130 to 132, 330) in which a protrusion height (H1, H2) locally protruding from the bottom surface is less than the predetermined depth (D).