POLISHING PAD FOR POLISHING BACKSIDE OF WAFER INCLUDING MICROTEXTURE SURFACE

• Main Authors: KIM SUB, OH SEUNG TAEK, KIM PAL KON
• Format: Patent
• Language: English; Korean
• Published: 21.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

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