BACK SIDE DEPOSITION APPARATUS AND APPLICATIONS

• Main Authors: SEXTON GREGORY, CHATTOPADHYAY KAUSHIK, KIM YUNSANG, HONG YOUN GI
• Format: Patent
• Language: English; Korean
• Published: 29.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

본 명세서에 개시된 실시예들은 기판의 전면 또는 후면 상에 응력 보상층들 또는 희생층들을 증착하기 위한 방법들 및 장치에 관한 것이다. 다양한 구현예들에서, 웨이퍼가 정상적인 전면 상향 배향에 있는 동안, 후면 증착이 발생한다. 전면/후면 증착은 웨이퍼의 전면 상의 증착을 통해 도입된 응력을 감소시키도록 수행될 수도 있다. 후면 증착은 또한 포토리소그래피와 같은 증착 후 프로세싱 동안 발생하는 후면 입자 관련 문제들을 최소화하도록 수행될 수도 있다. The embodiments disclosed herein pertain to methods and apparatus for depositing stress compensating layers and sacrificial layers on either the front side or back side of a substrate. In various implementations, back side deposition occurs while the wafer is in a normal front side up orientation. The front/back side deposition may be performed to reduce stress introduced through deposition on the front side of the wafer. The back side deposition may also be performed to minimize back side particle-related problems that occur during post-deposition processing such as photolithography.