접착 필름 및 그 평가 방법, 및, 반도체 장치의 제조방법 및 다이싱·다이본딩 일체형 필름

• Main Authors: TAIRA AYAKO, TAZAWA TSUYOSHI, TANIGUCHI KOHEI, YAMAMOTO KAZUHIRO, NAKAMURA KANAMI
• Format: Patent
• Language: Korean
• Published: 10.11.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; TESTING; USE OF MATERIALS AS ADHESIVES

반도체 장치의 제조 프로세스에 있어서 사용되는 접착 필름의 평가 방법으로서, 가열된 프로브로 택 시험을 행하는 공정을 포함하고, 평가 대상의 접착 필름의 두께가 20μm 이하인, 접착 필름의 평가 방법. 이 택 시험은, 예를 들면, 접착 필름의 시료를 지지하는 스테이지와, 스테이지에 대하여 상하 방향으로 이동 가능하며 또한 온도 설정이 가능한 프로브를 구비하는 장치를 사용하고, 스테이지와 시료의 사이에 폴리이미드 필름을 개재시킨 상태에서 행해진다. A method for evaluating a bonding film which is used in a production process of a semiconductor device, the method comprising a step in which a tack test is carried out by means of a heated probe. With respect to this method for evaluating a bonding film, the thickness of a bonding film to be evaluated is 20 μm or less. This tack test uses, for example, an apparatus which is provided with a stage that supports a bonding film sample and a probe that is vertically movable with respect to the stage, while being able to be set to a specific temperature; and this tack test is carried out in a state where a polyimide film is interposed between the stage and the sample.