LIQUID PROCESSING APPARATUS LIQUID PROCESSING METHOD AND STORAGE MEDIUM

• Main Authors: HIRAO TAKESHI, SUNG DONGJU
• Format: Patent
• Language: English; Korean
• Published: 23.10.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; NATURALLY-OCCURRING ELECTRICITY; NOZZLES; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; STATIC ELECTRICITY; TRANSPORTING

The purpose of the present invention is to properly spread processing liquid supplied to a substrate and suppress variations in the film thickness of the substrate to which the processing liquid is applied. A resist application device (1) of the present invention has a coating liquid nozzle (41) and a waiting bus (50) installed in a waiting area (90), which is an area outside the space above the substrate (W) to accommodate the coating liquid nozzle (41) during non-processing when liquid processing is not performed. The waiting bus (50) has an insulating member (51) arranged to surround the coating liquid nozzle (41) and a conductive member (52) disposed below the tip of the coating liquid nozzle (41) and grounded. In addition, as shown in Figure 3, a through-hole (TH) through which the resist passes is formed so as to penetrate the insulating member (51) and the conductive member (52). 본 발명은, 기판에 공급되는 처리액을 적절하게 제전하여, 처리액이 도포된 기판의 막 두께에 편차가 생기는 것을 억제하는 것을 목적으로 한다. 레지스트 도포 장치(1)는, 도포액 노즐(41)과, 기판(W)의 위쪽 공간의 외측 구역인 대기 구역(90)에 설치되고, 액처리가 행해지지 않는 비처리시에, 도포액 노즐(41)을 수용하는 대기 버스(50)를 구비하고 있다. 대기 버스(50)는, 도포액 노즐(41)을 둘러싸도록 배치된 절연 부재(51)와, 도포액 노즐(41)의 선단보다 아래쪽에 배치됨과 더불어 접지된 도전 부재(52)를 갖고 있다. 그리고, 도 3에 도시된 바와 같이, 절연 부재(51) 및 도전 부재(52)를 관통하도록, 레지스트를 통과시키는 관통 구멍(TH)이 형성되어 있다.