PROTECTIVE FILM FORMING FILM COMPOSITE SHEET FOR FORMING PROTECTIVE FILM METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND USE OF PROTECTIVE FILM FORMING FILM

• Main Authors: DOKA MISAKI, KOMASU YUICHIRO, YAMAMOTO DAISUKE
• Format: Patent
• Language: English; Korean
• Published: 10.10.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

A thermosetting protective layer forming film is a laminate of a plurality of the protective layer forming films. When the storage modulus E' was measured for the first test piece with a width of 4 mm in a temperature range of 23 to 70℃, the minimum value E'(1) is 45 MPa or less, and the maximum value E'(2) is 200 MPa or more. It is a cured product obtained by thermosetting a plurality of laminates of the protective layer forming film. When measuring the storage modulus E' under the same conditions for the second test piece with a width of 5 mm, the minimum value E'(3) is 500 MPa or more. 열경화성 보호막 형성 필름으로서, 복수장의 상기 보호막 형성 필름의 적층물이고, 폭 4㎜의 제1 시험편에 대해, 23∼70℃의 온도 범위에서 저장 탄성률 E'를 측정했을 때, 그 최소값 E'(1)이 45MPa 이하이며, 또한 그 최대값 E'(2)가 200MPa 이상이고, 복수장의 상기 보호막 형성 필름의 적층물을 열경화시켜 얻어진 경화물이며, 폭 5㎜의 제2 시험편에 대해, 동일 조건으로 저장 탄성률 E'를 측정했을 때, 그 최소값 E'(3)이 500MPa 이상인, 보호막 형성 필름.