다이싱 필름 기재용 수지 조성물, 다이싱 필름 기재, 및 다이싱 필름

• Main Authors: NISHIJIMA KOICHI, NAKANO SHIGENORI, TAKAOKA HIROKI, SAKUMA MASAMI
• Format: Patent
• Language: Korean
• Published: 05.10.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

상온 및 저온에 있어서의 신장성이 우수하고, 나아가서는 상온 및 저온에 있어서의 모듈러스 강도도 우수한 다이싱 필름 기재를 실현 가능한 다이싱 필름 기재용 수지 조성물의 제공을 과제로 한다. 상기 과제를 해결하는 다이싱 필름 기재용 수지 조성물은, 에틸렌·불포화 카르본산계 공중합체의 아이오노머 (A)와, 폴리아미드 (B)와, 스티렌계 수지 (C)를 포함한다. The present invention addresses the problem of providing a resin composition for dicing film substrates which is able to form dicing film substrates excellent in terms of ordinary-temperature and low-temperature stretchability and ordinary-temperature and low-temperature modulus strength. The resin composition for dicing film substrates comprises an ionomer (A) of an ethylene/(unsaturated carboxylic acid)-based copolymer, a polyamide (B), and a styrene-based resin (C).