접착제 조성물, 전자 부품용 접착제 및 휴대 전자 기기용접착제

• Main Authors: TAMAGAWA TOMOKAZU, JO KON, KIDA TAKUMI, YUUKI AKIRA, HAGIWARA KOUHEI
• Format: Patent
• Language: Korean
• Published: 08.09.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

본 발명의 접착제 조성물은, 폴리카보네이트 골격 및 폴리에스테르 골격 중 적어도 어느 하나를 갖고, 또한 이소시아네이트기와 (메타)아크릴로일기를 갖는 습기 경화성 수지 (A)와, 이소시아네이트기를 갖고, 또한 (메타)아크릴로일기를 갖지 않는 습기 경화성 수지(B)를 포함한다. An adhesive composition according to the present invention contains: a moisture-curable resin (A) which has at least one of a polycarbonate skeleton and a polyester skeleton, while having an isocyanate group and a (meth)acryloyl group; and a moisture-curable resin (B) which has isocyanate group, but does not have a (meth)acryloyl group.