스퍼터링 타깃 및 그 제조 방법

• Main Authors: SATO YUSUKE, SATO TAKANORI, KAMINAGA KENGO
• Format: Patent
• Language: Korean
• Published: 05.09.2023
• Subjects: ALLOYS; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

스퍼터링 타깃의 균열을 억제할 수 있는, Al 함유량이 높은 Cu-Al 2원 합금 스퍼터링 타깃 및 그 제조 방법을 제공한다. Cu 및 Al의 2원 합금을 포함하고, 잔부가 불가피적 불순물로 이루어지는 소결체로 구성되는 스퍼터링 타깃이며, Cu와 Al의 함유량(at％)이 0.48≤Al/(Cu+Al)≤0.70의 관계식을 충족하고, 상대 밀도가 95％ 이상인 스퍼터링 타깃. Provided are a Cu-Al binary alloy sputtering target having a high Al content and a method for producing the same, which make it possible to suppress cracking of a sputtering target. The present invention provides a sputtering target composed of a sintered body containing a binary alloy of Cu and Al, with the balance consisting of unavoidable impurities, wherein the contents (at%) of Cu and Al satisfy the following relational expression: 0.48 ≤ Al/(Cu + Al) ≤ 0.70, and the relative density is 95% or more.