실리콘 조성물

• Main Authors: REN HUA, XU YIFAN, CHEN WENJIE, SOOTSMAN JOSEPH RONALD, SU FENGYI
• Format: Patent
• Language: Korean
• Published: 29.08.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WORKING-UP

(A) 전기 전도성 충전제, (B) 폴리디오르가노실록산 중합체, (C) 폴리오르가노하이드로겐실록산, (D) 히드로실릴화 반응 촉매, (E) 중합체 첨가제, 및 선택적으로 (F) 히드로실릴화 반응 억제제를 포함하는 실리콘 조성물은 부가혼합 시 낮은 복합 점도를 가지고, 경화 시 열 노화 후 높은 전기 전도도 및 양호한 전기 전도도 유지를 제공한다. A silicone composition comprising (A) an electrically conductive filler, (B) a polydiorganosiloxane polymer, (C) a polyorganohydrogensiloxane, (D) a hydrosilylation reaction catalyst, (E) a polymer additive, and optionally (F) a hydrosilylation reaction inhibitor has a low complex viscosity upon admixing and upon cure provides a high electrical conductivity and good electrical conductivity retention after heat aging.