중공 입자 및 그 제조 방법, 그리고 수지 조성물

• Main Authors: EGAMI MIKI, ENOMOTO NAOYUKI, ARAKANE HIROTADA, MURAGUCHI RYO, TANIGUCHI MASANOBU
• Format: Patent
• Language: Korean
• Published: 25.08.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; INORGANIC CHEMISTRY; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

본 발명은 무공질의 외각의 내부에 공동을 갖는 중공 입자에 관한 것이다. 평균 입자경(D50)이 0.1 내지 10㎛이고, 물에 현탁했을 때, 부유 입자가 0.5 내지 7.0질량%, 현탁 입자가 0 내지 4.0질량%, 침강 입자가 89.0 내지 99.5질량%이다. 이러한 중공 입자를 배합한 절연 재료는, 낮은 유전율화 및 낮은 유전 정접을 가능하게 한다. The present invention pertains to hollow particles each having a cavity inside a non-porous outer shell. The hollow particles have a mean particle diameter (D50) of 0.1-10 μm, and, when being suspended in water, the proportions of floating particles, suspended particles, and sedimented particles are 0.5-7.0 mass%, 0-4.0 mass%, and 89.0-99.5 mass%, respectively. An insulation material having such hollow particles blended therein is capable of having a low dielectric constant and a low dielectric loss tangent.