조성물 및 시트

열팽창성의 중공 입자인 제1 중공 입자와, 제1 중공 입자 이외의 중공 입자인 제2 중공 입자와, 중합성 화합물을 함유하는, 조성물. A composition containing first hollow particles being thermally expandable hollow particles; second hollow particles being hollow particles other than the first hollow particles; and a polymerizable compound....

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Bibliographic Details
Main Authors FURUKAWA NAOKI, MATSUBARA NOZOMI, HIGASHIUCHI TOMOKO, YOKOTA HIROSHI
Format Patent
LanguageKorean
Published 22.08.2023
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:열팽창성의 중공 입자인 제1 중공 입자와, 제1 중공 입자 이외의 중공 입자인 제2 중공 입자와, 중합성 화합물을 함유하는, 조성물. A composition containing first hollow particles being thermally expandable hollow particles; second hollow particles being hollow particles other than the first hollow particles; and a polymerizable compound.
Bibliography:Application Number: KR20237020865