Interconnect structure and electronic device including the same

An embodiment provides an interconnect structure. The interconnect structure includes: a dielectric layer in which a trench is formed; a conductive wire including graphene and provided to fill the trench; and a liner layer including metal and provided to be in contact with at least one surface of th...

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Main Authors KIM, SANG WON, SHIN, KEUN WOOK, BYUN, KYUNG EUN, LEE, EUN KYU, LEE, CHANG SEOK, JUNG, A LUM, YOO, JOUNG EUN
Format Patent
LanguageEnglish
Korean
Published 02.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOUNDS THEREOF
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INORGANIC CHEMISTRY
METALLURGY
NON-METALLIC ELEMENTS
SEMICONDUCTOR DEVICES
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Summary:An embodiment provides an interconnect structure. The interconnect structure includes: a dielectric layer in which a trench is formed; a conductive wire including graphene and provided to fill the trench; and a liner layer including metal and provided to be in contact with at least one surface of the conductive wire. 일 실시예는, 트렌치가 형성된 유전체층, 상기 트렌치의 내부를 채우도록 마련되는 것으로 그래핀을 포함하는 도전성 배선 및 상기 도전성 배선의 적어도 일면에 접촉하여 마련되는 것으로 금속을 포함하는 라이너층을 포함하는, 인터커넥트 구조체를 제공한다.
Bibliography:Application Number: KR20220011788