MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

• Main Authors: YOSHIDA SHINYA, NAGAE TOMOKI, YOTO TAKUYA, KUNO TATSUYA, INOUE SEIYA, OGISO YUSUKE
• Format: Patent
• Language: English; Korean
• Published: 28.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A member (10) for a semiconductor manufacturing apparatus comprises: a ceramic plate (20), a porous plug (50), an insulation cover (56), and fine holes (58). The ceramic plate (20) has a wafer arrangement surface (21) on the upper surface. The porous plug (50) is arranged in a plug insertion hole (24) vertically penetrating the ceramic plate (20), and allows gas to be distributed. The insulation cover (56) is installed to come in contact with the upper surface of the porous plug (50), and is exposed to the wafer arrangement surface (21). The fine holes (58) are formed on the insulation cover (56) in plural numbers, and vertically penetrate the insulation cover (56). Therefore, machinability can be improved. 반도체 제조 장치용 부재(10)는, 세라믹 플레이트(20)와, 다공질 플러그(50)와, 절연 덮개(56)와, 세공(58)을 갖는다. 세라믹 플레이트(20)는 상면에 웨이퍼 배치면(21)을 갖는다. 다공질 플러그(50)는, 세라믹 플레이트(20)를 상하 방향으로 관통하는 플러그 삽입 구멍(24)에 배치되고, 가스의 유통을 허용한다. 절연 덮개(56)는, 다공질 플러그(50)의 상면에 접하도록 설치되고, 웨이퍼 배치면(21)에 노출된다. 세공(58)은, 절연 덮개(56)에 복수 형성되고, 절연 덮개(56)를 상하 방향으로 관통한다.