말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지

• Main Authors: KAKITANI MINORU, GOZU SHUJI, HAYASHI CHIHIRO, SATO NAOYOSHI, AKEBI RYUJI, TANIGAWA TAKAO
• Format: Patent
• Language: Korean
• Published: 14.07.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

(A) N-치환 말레이미드기를 1개 이상 갖는 말레이미드 화합물 및 그의 유도체로 이루어지는 군에서 선택되는 1종 이상과, (B) 주쇄에 탄화수소쇄 또는 폴리에테르쇄를 갖는 폴리머를 함유하고, 상기 (A) 성분이, 25℃에서, 알코올계 용제, 케톤계 용제, 방향족 탄화수소계 용제, 에스테르계 용제 또는 질소 원자 함유 용제에 대하여 30질량％ 이상 용해하는 것인, 말레이미드 수지 조성물, 해당 말레이미드 수지 조성물을 사용한 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지에 관한 것이다. The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25°C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.