표면 처리 구리박, 동장 적층판 및 프린트 배선판

• Main Authors: MATSUOKA YUKI, IWASAWA SHOHEI, GOTO IKUHIRO, NAKASHIMA SEIYA, MIKI ATSUSHI
• Format: Patent
• Language: Korean
• Published: 10.07.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

구리박과, 이 구리박의 적어도 한쪽의 면에 형성된 표면 처리층을 갖는 표면 처리 구리박이다. 표면 처리층은, Sku가 2.50 내지 4.50, Str이 0.20 내지 0.40이다. A surface-treated copper foil comprising a copper foil and a surface-treating layer formed on at least one surface of the copper foil. The surface-treating layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.