COMPOSITION FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE ENCAPSULATION FILM AND ORGANIC ELECTRONIC DEVICE INCLUDING THE SAME

• Main Authors: JOON HO KIM, SEON HO JO, TAE YONG HA, SANG GYU LEE, WAN HEE JEONG
• Format: Patent
• Language: English; Korean
• Published: 07.07.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to a composition for encapsulating an organic electronic device, an encapsulation film, and an organic electronic device including the same. Since a novel composition for encapsulation capable of forming an encapsulating layer composed of a single layer is provided, manufacturing yield is high, costs are reduced, interlayer delamination, which can occur when moisture is removed, does not occur, and moisture resistance and heat resistance of the composition are excellent. 본 발명은 유기전자장치 봉지용 조성물, 봉지 필름 및 이를 포함한 유기전자장치에 관한 것이다. 본 발명은 단일층으로 구성된 봉지층을 형성할 수 있는 신규의 봉지용 조성물을 제공함에 따라, 본 발명은 제조 수율이 높고 원가가 절감되며 수분이 제거될 때 발생할 수 있는 층간 박리현상이 일어나지 않는 동시에 내습성 및 내열성이 우수하다.