POLYAMIDE-BASED IMPACT-RESISTANT HEAT DISSIPATION MATERIAL AND MANUFACTURING METHOD THEREOF

• Main Authors: PARK BYUNG UK, AHN SUNG HO, KIM SANG GU, YUN JIN HEE
• Format: Patent
• Language: English; Korean
• Published: 05.07.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to a polyamide-based impact resistance heat dissipation material and a manufacturing method thereof. Specifically, the present invention provides an impact resistance heat dissipation member which includes a polyamide resin, a polyolefin elastomer acid-modified resin, and a heat sink containing graphite, graphene nanoplatelets, and carbon nanotubes. 본 발명은 폴리아마이드계 내충격성 방열소재 및 이의 제조방법에 관한 것이다. 구체적으로, 폴리아미드 수지, 폴리올레핀 엘라스토머 산 변성수지 및 그라파이트, 그래핀 나노플레이트렛 및 카본 나노튜브를 함유하는 방열재를 포함하는 내충격성 방열소재를 제공하는 것이다.